摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition directly usable for molded products of various thicknesses and useful for producing acrylic resin molded products of high hardness degree uniform in their thickness direction with excellent appearance, durability, heat resistance and impact resistance, etc. SOLUTION: This thermosetting resin composition comprises (A) a syrup prepared by dissolving (a3) an alkyl methacrylate homopolymer and/or copolymer in (a1) an alkyl methacrylate or (a2) anα,β-ethylenically unsaturated monomer mixture consisting mainly of the component a1, (B) a compound having at least two (meth)acryloyl groups, (C) a peroxide, and (D) an inorganic filler; wherein the component C is a peroxide consisting mainly of a peroxyketal having an exothermic peak at >=110 deg.C but <130 deg.C, with an active oxygen content of 0.05-0.2 wt.%.
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