发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition directly usable for molded products of various thicknesses and useful for producing acrylic resin molded products of high hardness degree uniform in their thickness direction with excellent appearance, durability, heat resistance and impact resistance, etc. SOLUTION: This thermosetting resin composition comprises (A) a syrup prepared by dissolving (a3) an alkyl methacrylate homopolymer and/or copolymer in (a1) an alkyl methacrylate or (a2) anα,β-ethylenically unsaturated monomer mixture consisting mainly of the component a1, (B) a compound having at least two (meth)acryloyl groups, (C) a peroxide, and (D) an inorganic filler; wherein the component C is a peroxide consisting mainly of a peroxyketal having an exothermic peak at >=110 deg.C but <130 deg.C, with an active oxygen content of 0.05-0.2 wt.%.
申请公布号 JP2000204117(A) 申请公布日期 2000.07.25
申请号 JP19990005866 申请日期 1999.01.12
申请人 KURARAY CO LTD 发明人 FURUSAWA SHINGO;ISOI SHUJI;IKEDA MINORU
分类号 C08L33/06;C08F2/02;C08F2/44;C08F4/38;C08F20/10;(IPC1-7):C08F20/10 主分类号 C08L33/06
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