发明名称 |
RESIN COMPOSITION FOR DIELECTRIC LAYER FORMATION AND FILM FOR DIELECTRIC LAYER FORMATION |
摘要 |
A resin composition for dielectric layer formation and a film for dielectric layer formation, from each of which a dielectric layer having an even thickness can be easily formed by applying the composition or film to a desired part of a substrate and baking it. The dielectric layer thus formed neither contains residual carbon nor has craters. The resin composition is obtained by adding 100 to 500 parts by weight of a powder of an inorganic dielectric to 100 parts by weight of a self-adhesive resin which is obtained by polymerizing 80 to 100 wt.% C1-12 methacrylic ester with 0 to 20 wt.% other monomer copolymerizable therewith and optionally with 0.5 to 10 wt.% carboxylated monomer and has a weight-average molecular weight of 20,000 to 1,000,000 and a glass transition temperature of 15 DEG C or lower. The film is obtained by spreading the resin composition on a flexible film.
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申请公布号 |
WO0042622(A1) |
申请公布日期 |
2000.07.20 |
申请号 |
WO1999JP00116 |
申请日期 |
1999.01.14 |
申请人 |
SOKEN CHEMICAL & ENGINEERING CO., LTD.;TOMITA, KOJI |
发明人 |
TOMITA, KOJI |
分类号 |
H01B3/42;(IPC1-7):H01B3/00;C08L33/04 |
主分类号 |
H01B3/42 |
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