| 摘要 |
<p>A power semiconductor module (1), whereby connector elements (4) are accommodated in the openings of a plastic housing (2). The power semiconductor module is also provided with a closing cover (12). The connector elements protrude above the cover and jut out of the openings. The openings are created when the cover and the plastic housing are assembled together and the connector elements protrude therethrough, whereby any arrangement of the connector elements in the power semiconductor module is possible. The cover closes the power semiconductor module at points where no connector elements are provided.</p> |
