| 摘要 |
A procedure for processing and making endodontic instruments has laser processing techniques employed for the profiling. A laser beam shape cutting procedure is employed whereby the material to be removed is evaporated. A pulsed Nd:YAG or CO2 laser (12) with average power of 10 watts to 2 kilowatts is employed. The material for making endodontic instruments is a super-elastic nickel-titanium alloy. The laser processing technique used for the profiling removes the groove in a secant-shaped fashion. |
