发明名称 LASER BEAM MACHINING AND LASER BEAM MACHINE
摘要 <p>As many beam distributing/shaping devices (21a, 21b) as the number of heads (7a, 7b) are disposed in series on an optical path of a laser beam (2) emitted from a laser oscillator (1). Then, the devices (21a, 21b) are operated to supply a laser pulse to one of positioning-completed heads. A laser beam (2) with a generally constant energy quantity can be supplied to a machining unit by selecting a timing at which the devices (21a, 21b) are operated, whereby it is possible to machine a high-quality hole by effectively using a laser oscillator and accurately controlling a machining energy.</p>
申请公布号 WO0041839(A1) 申请公布日期 2000.07.20
申请号 WO2000JP00124 申请日期 2000.01.13
申请人 HITACHI VIA MECHANICS, LTD.;ARAI, KUNIO;WATANABE, HUMIO 发明人 ARAI, KUNIO;WATANABE, HUMIO
分类号 B23K26/06;B23K26/067;B23K26/073;B23K101/42;G02B26/10;H05K3/00;H05K3/46;(IPC1-7):B23K26/06 主分类号 B23K26/06
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