发明名称 Verfahren zum Löten eines isolierten Drahtes
摘要 The method involves bending the uninsulated end (2) of the wire (1) into a U- or V-shaped hook with a bending position and inserting it into the solder hole (4) in the circuit board (3) so that the bending point (6) protrudes out of the other side of the hole. Soldering is then performed on both sides of the board so that part of the insulated wire is permanently enclosed by the solder. The method is used for flexurally and motionally elastic mounting of electrical components or assemblies.
申请公布号 DE19528315(C2) 申请公布日期 2000.07.20
申请号 DE1995128315 申请日期 1995.08.02
申请人 TEMIC TELEFUNKEN MICROELECTRONIC GMBH 发明人 SCHIRMER, KLAUS
分类号 H01R43/02;H05K3/34 主分类号 H01R43/02
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