发明名称 Surface treatment of an insulating film
摘要 This invention is directed to a method for the reform of an undercoating surface prior to the formation of a prospective film by the CVD technique using a reaction gas containing an ozone-containing gas having ozone contained in oxygen and TEOS. This method comprises the steps of forming an undercoating insulating film 5 on a substrate by the use of a mixed gas consisting of an ozone-containing gas having ozone contained in oxygen in a concentration of not less than 4% and a first silicon-containing gas, and reforming the surface of said undercoating insulating film 5 by exposing said surface to a second silicon-containing <IMAGE>
申请公布号 EP0945898(A3) 申请公布日期 2000.07.19
申请号 EP19980111078 申请日期 1998.06.17
申请人 SEMICONDUCTOR PROCESS LABORATORY CO., LTD. 发明人 KOMIYAMA, HIROSHI;TSUKAMOTO, KOUJI
分类号 H01L21/316;H01L21/768 主分类号 H01L21/316
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