Method of manufacturing multilayer printed wiring board

摘要

Apply photosensitive resin to an internal conductive pattern layer 2 as well as to an inside layer which has a hole 3a filled with conductive paste 3b. Form a hole 4a communicating to the internal conductive pattern layer 2 by exposure and development. Then, form metal plated film 6a on the surface of the photosensitive resin 4 including the hole 4a. Process this metal plated film 6a into an external conductive pattern layer 6. This manufacturing method can increase the wiring density on the external conductive pattern layer 6, and thus the multilayer printed wiring board of the higher wiring density can be obtained.