发明名称 COMPRESSION BONDED SEMICONDUCTOR DEVICE
摘要 <p>A compression bonded semiconductor device used for a large capacity converter for driving a rolling mill for paper-making/steel-manufacturing in which a GCT can be easily attached/detached to/from a gate driver, wherein a second stacked electrode (47) is extended under a connection section (38b) where an external gate terminal (38) and a platelike control-gate electrode (48) are electrically connected, and a support member (53) being concentrical with the external gate terminal (38) between the connection section (38b) and the second stacked electrode (47) and having a second elastic body (54) pressing the connection section (38b) is disposed.</p>
申请公布号 WO2000042664(P1) 申请公布日期 2000.07.20
申请号 JP1999000120 申请日期 1999.01.18
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址