| 摘要 |
PROBLEM TO BE SOLVED: To obtain a removing solution composition for a photoresist having superior removing capability to any of a photoresist film and a degenerated film and capable of effectively preventing the corrosion of a substrate with a formed metallic film, in particular an Al, Al alloy or Ti film, even under conditions of high temperature treatment and to remove a photoresist using the composition. SOLUTION: This removing solution composition consists of (a) 2-30 wt.% hydroxylamines, (b) 2-35 wt.% water, (c) 25-40 wt.% monoethanolamine and/or 2-(2-aminoethoxy) ethanol, (d) 20-32 wt.% N-methyl-2-pyrrolidone and/or diethylene glycol monobutyl ether and (e) 2-20 wt.% aromatic hydroxy compound. |
