| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold method for preventing sealing resin from penetrating into electrodes or through-holes on the back face of an insulating substrate without using amxiliary materials such as a barrier or a seal film. SOLUTION: This method comprises an insulating substrate manufacturing process for manufacturing plural insulating substrates 2, in which circuit patterns 4a and 4b on the surface side of the insulating substrate 2 are respectively connected with through-holes 7a and 7b, a process for assembling an electronic component element 3 constituted of a bonding process for bonding plural electronic component elements 3 on the surfaces of the insulating substrates 2, a protecting film adhering process for adhering and pressurizing a protecting film to the back face of the insulating substrate 2 and for pushing and packing protecting film adhesive in the through-holes, a resin sealing process for resin- sealing the surface side of the insulating substrate 2, a protecting film peeling process for peeling the protecting film, and a dicing process for dicing and separating this into individual electronic components. |
