| 摘要 |
PROBLEM TO BE SOLVED: To enhance solder strength at a part where solder creeps over a groove part by making a groove in each of two sides abutting on the outer surface of a base part and forming a conduction electrode at the groove part. SOLUTION: A groove part 2 continuous to the surface and rear surface of at least one of two base parts 1 on two sides of a conduction electrode 3 is made in the side face of the base part 1 where the conduction electrodes 3 are arranged at four corners of a base ceramic board. Since a groove part 2 forming the conduction electrode 3 of at least one base part 1 on each of two sides holding the corner part of the conduction electrode 3 is present in the side face of the base part 1, a solder pool is ensured in the groove part 2 from two directions, i.e., horizontal and vertical directions, after soldering work onto a mounting circuit board. Since warp of the mounting circuit board, external impact during manufacture, dropping or stripping of electronic component case due to thermal stress and cracking at a soldered part can be suppressed, oscillation frequency shift or unoscillation can be eliminated significantly after mounting on the mounting circuit board.
|
