| 摘要 |
PROBLEM TO BE SOLVED: To resolue problems in which a contact pin for the inspection of a wiring pattern on a printed-circuit board is hardly connected electrically and stably to a very small inspection pad and to restrain the contact pin from being peeled off easily from an electrode pad. SOLUTION: A thermoplastic resin layer 21 with which an oxidizing agent is mixed is formed. A resist 25 is patterned so as to be left on the electrode pad 12 of a printed-circuit board by a lithographic technique. After that, parts other than the electrode pad 12 in the thermoplastic resin layer 21 are etched. The thermoplastic resin layer 21 is doped with a monomer which can form a conductive polymer. In addition, the thermoplastic resin layer 21 is coated with a thermoplastic resin for protection. The resist is stripped together with the thermoplastic resin for protection, on the electrode pad 12. Then, the thermoplastic resin layer 21 can be doped with a monomer which can form a conductive polymer.
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