发明名称 Process for making high performance MOSFET with scaled gate electrode thickness
摘要 A process for making a high performance MOSFET with a scaled gate electrode thickness. In one embodiment, the process comprises first providing a substrate. A gate dielectric layer is formed on the substrate, and a gate electrode is formed on the gate dielectric layer. A middle portion of the gate electrode has a first height, and side portions of the gate electrode have heights that are less than the first height. A dopant species is implanted at a first energy level and at a first concentration, whereby lightly doped drain regions are formed in the substrate below the side portions of the gate electrode.
申请公布号 US6090676(A) 申请公布日期 2000.07.18
申请号 US19980149210 申请日期 1998.09.08
申请人 ADVANCED MICRO DEVICES, INC. 发明人 GARDNER, MARK I.;FULFORD, H. JIM;MAY, CHARLES E.
分类号 H01L21/265;H01L21/28;H01L21/336;H01L29/423;(IPC1-7):H01L21/336 主分类号 H01L21/265
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