发明名称 |
Process for making high performance MOSFET with scaled gate electrode thickness |
摘要 |
A process for making a high performance MOSFET with a scaled gate electrode thickness. In one embodiment, the process comprises first providing a substrate. A gate dielectric layer is formed on the substrate, and a gate electrode is formed on the gate dielectric layer. A middle portion of the gate electrode has a first height, and side portions of the gate electrode have heights that are less than the first height. A dopant species is implanted at a first energy level and at a first concentration, whereby lightly doped drain regions are formed in the substrate below the side portions of the gate electrode.
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申请公布号 |
US6090676(A) |
申请公布日期 |
2000.07.18 |
申请号 |
US19980149210 |
申请日期 |
1998.09.08 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
GARDNER, MARK I.;FULFORD, H. JIM;MAY, CHARLES E. |
分类号 |
H01L21/265;H01L21/28;H01L21/336;H01L29/423;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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