发明名称 Process for etching oxides in an electromagnetically coupled planar plasma apparatus
摘要 In an apparatus for producing an electromagnetically coupled planar plasma comprising a chamber having a dielectric shield in a wall thereof and a planar coil outside of said chamber and adjacent to said window coupled to a radio frequency source, the improvement whereby a scavenger for fluorine is mounted in or added to said chamber. When a silicon oxide is etched with a plasma of a fluorohydrocarbon gas, the fluorine scavenger reduces the free fluorine radicals, thereby improving the selectivity and anisotropy of etching and improving the etch rate while reducing particle formation.
申请公布号 US6090303(A) 申请公布日期 2000.07.18
申请号 US19960761045 申请日期 1996.12.05
申请人 APPLIED MATERIALS, INC. 发明人 COLLINS, KENNETH S.;MARKS, JEFFREY
分类号 H01L21/00;H05H1/00;(IPC1-7):H05H1/00 主分类号 H01L21/00
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