Process for preserving solder paste,申请号SG19970000519-传众专利搜索

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发明名称	Process for preserving solder paste
摘要
申请公布号	SG74005(A1)	申请公布日期	2000.07.18
申请号	SG19970000519	申请日期	1997.02.27
申请人	MITSUBISHI GAS CHEMICAL COMPANY, INC.	发明人	WATANABE HIDEAKI;WATANABE TAKAYUKI
分类号	B65D81/26;H05K3/34;(IPC1-7):B65D81/26	主分类号	B65D81/26
代理机构		代理人
主权项
地址

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