| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid module, which is high in heat radiating property and reliability and enables to mount with high density. SOLUTION: A circuit substrate 11 is formed with a multilayer printed substrate, made of a plurality of insulator layers 14 and an electrode layer 15, a recess part 17 to which a radiating electrode 15a of the electrode layer 15 is exposed is formed on a main face 16 of the circuit substrate 11, circuit parts 13 are adhered to the radiating electrode 15a exposed to a bottom face of the recess part 17, and also an external electrode 23 jointed to the radiant electrode 15a is formed on a side face of the circuit substrate 11 to constitute a hybrid module 10. As a result, since heat generated in the circuit parts 13 is radiated from the radiating electrode 15a and external electrode 23 without going via the insulator layer 14 of the circuit substrate 11, heat radiating property becomes superior. Furthermore, since stress from a master circuit substrate is not applied to the circuit substrate 13, reliability is improved, and since the circuit parts 13 are mounted in the recess part 17 formed on the circuit substrate 11, mounting density is improved. |
