| 摘要 |
PROBLEM TO BE SOLVED: To ensure high reliability by fixing a frame to a base part and an intermediary circuit through solder balls and burying the frame and a cavity made of a reinforcing material in a compound. SOLUTION: An integrating circuit chip 301 is connected electrically with a metallized contact pad on the first surface 303a of an intermediary circuit 303 having second surface 303b bonded to the base part of a package, i.e., a planar reinforcing material 304, through an insulating adhesive 314. A frame 305 fixed to the intermediary circuit 303 on the reinforcing material through solder balls 308 defines a cavity of the package and supports the contacts of an external BGA solder ball 306. An embedded material 307 mechanically supports solder balls 302 at flip chip joint and the solder ball joint 308 between the intermediary circuit and the frame. In order to protect the cavity of the package, the chip and the interconnection against contaminants and to enhance mechanical support of the package, they are buried in a polymer compound 309. |
