发明名称 |
Method and reduction solution for metallizing a surface |
摘要 |
<p>A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu2O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.</p> |
申请公布号 |
SG73952(A1) |
申请公布日期 |
2000.07.18 |
申请号 |
SG19950001995 |
申请日期 |
1995.12.01 |
申请人 |
MOTOROLA INC. |
发明人 |
SAVIC JOVICA;BROWN, VERNON, L.;MAGERA, YAROSLAW, A. |
分类号 |
C23C18/16;C23C18/28;H05K3/18;(IPC1-7):C23C18/38;C23C18/44;C23C18/40 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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