| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cutting a solder surface of a printed circuit board, whereby electronic components mounted on the board can be surely and easily removed by accurately cutting the solder surface of each of printed circuit boards having various shapes, using a machining cutter. SOLUTION: A laser position sensor 7 is moved relatively over a solder surface 3a to continuously measure the distance between this sensor 7 and the solder surface 3a, and protrusions 5a on the solder surface 3a and a resin surface of a resin material constituting the board body are separately detected from the variation level of that measured value. The height position of the machining cutter 6 is set, based on this detection result, and the solder surface is cut down to a level exposing the resin surface, using the machining cutter 6.
|
