| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a heat sink which can be manufactured in a short period of time, without degrading thermal conductivity and with which the wire length of a bonding wire can be shortened. SOLUTION: A method is provided for manufacturing a heat sink, which is used by adhering to the bottom plane of a substrate, so as to cover an electronic-component mounting hole that pierces the substrate of an electronic- component mounting board, and which has a mounting plane 42, that constitutes the bottom plane of the mounting hole and an adhering plane 41 that adheres to the bottom plane of the substrate, wherein the mounting plane 42 is indented lower than the adhering plane 41 to form a concave shape. A metal sheet 1 is placed on a die 2 having a recess 20, and is pressed by a punch 3, which faces to the dent, to indent an upper surface 127 of the work part 12, which is to be the mounting plane 42, to a lower position than the upper surface 117 of the non-work part 111, while the lower surface 128 of the work part is protruded. Then, the lower-side protruded part 152 is removed to make a flat surface.
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