| 发明名称 |
Multi-chip packaging using bump technology |
| 摘要 |
A multichip integrated semiconductor device having a portion of a first chip bonded to electrical leads in a package using a flip chip technology such as solder bump technology and a second chip bonded to a second portion of the first chip using a flip chip technology such as solder bump technology.
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| 申请公布号 |
US6091138(A) |
申请公布日期 |
2000.07.18 |
| 申请号 |
US19980032398 |
申请日期 |
1998.02.27 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
YU, ALLEN S.;STEFFAN, PAUL J.;SCHOLER, THOMAS CHARLES |
| 分类号 |
H01L25/065;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/065 |
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