| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and an assembling method thereof, where a bonding failure is prevented from occurring between the tip of a lead and a bonding wire. SOLUTION: In a semiconductor package, leads 301 to 304 are arranged to extend on a support board 2, and close contact grooves 31 to 34 are each provided to the inner parts of the leads 301 to 304. As the leads 301 to 304 are provided with the close contact grooves 31 to 34, the rear parts of the bonding regions of the tips of the inner parts of the leads can be brought into close contact with the surface of the support board 2 by pressing the tips of the inner parts with a lead pressing jig 12. Bonding wires 5 are each bonded to the tips of the inner parts by ultrasonic bonding. The close contact grooves 31 to 34 may be recessed, V-shaped or U-shaped in cross section. |
