发明名称 Vertical device formed adjacent to a wordline sidewall and method for semiconductor chips
摘要 A semiconductor device includes a substrate forming a trench, the trench including a storage node disposed within the trench. A wordline is disposed within the substrate and adjacent to a portion of the substrate. A vertically disposed transistor is included wherein the wordline functions as a gate, the storage node and a bitline function as one of a source and a drain such that when activated by the wordline the transistor conducts between the storage node and the bitline. The invention further includes a method of fabricating the semiconductor device with vertical transistors.
申请公布号 US6091094(A) 申请公布日期 2000.07.18
申请号 US19980095793 申请日期 1998.06.11
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 RUPP, THOMAS S.
分类号 H01L21/82;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119;H01L21/824 主分类号 H01L21/82
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