| 摘要 |
PROBLEM TO BE SOLVED: To prevent reflow cracks in a solder reflow step when a semiconductor device is mounted. SOLUTION: In a bonding method, a semiconductor device includes a supporting material, a semiconductive element 8, a bonding material 1 for bonding a semiconductor element, and a sealing resin 9 for sealing the semiconductor element. The semiconductor element 10 is bonded to a lead frame 5 through an organic bonding material 1 in a film form with a coefficient of water absorption of 1.5 vol.% or below, a saturation coefficient of water absorption of 1.0 vol.% or below, a residual volatile component of 3.0 wt.% or below, or a modulus of elasticity of 10 MPa or below. |
