| 发明名称 |
Lead frame with pre-mold paddle for a semiconductor chip package |
| 摘要 |
An improved lead frame with a pre-mold paddle for a semiconductor chip package which prevents delamination and cracking between a mold body and the pre-mold paddle on which a semiconductor chip in the semiconductor chip package is placed.
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| 申请公布号 |
US6091135(A) |
申请公布日期 |
2000.07.18 |
| 申请号 |
US19970997594 |
申请日期 |
1997.12.23 |
| 申请人 |
LG SEMICON CO., LTD. |
发明人 |
LEE, BYEONG DUCK |
| 分类号 |
H01L23/28;H01L21/56;H01L23/495;H01L23/50;(IPC1-7):H05K7/18 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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