SEMICONDUCTOR WAFER CONTAINING ALIGNMENT MARK FOR ALIGNING WAFER ON ALIGNER, ALIGNING SYSTEM FOR GENERATING ALIGNMENT SIGNAL FROM ALIGNMENT MARK, AND METHOD OF DETERMINING WAFER ALIGNMENT

摘要

PROBLEM TO BE SOLVED: To provide alignment marks for improving the accuracy of alignment, and an aligning system and a method using the same. SOLUTION: Alignment marks are formed in a lower one of layers on a semiconductor substrate which are to be subjected to a chemical mechanical polishing process, and forms an alignment signal waveform during processing for alignment exposure for manufacturing semiconductor elements. A plurality of mean or trench patterns are discontinuously arrayed at such as density as not to generate dishing in the layers which are subjected to the chemical mechanical polishing process. As a result, the alignment marks are prevented from being damaged even when the layers formed on the alignment marks are subjected to the chemical mechanical polishing process which is extensively used for manufacturing highly integrated semiconductor elements. Therefore, a correct alignment signal can be obtained.