发明名称 Device for monitoring the diameter of an orbitally mobile cylindrical piece during machining thereof
摘要 PCT No. PCT/FR96/01545 Sec. 371 Date Mar. 31, 1998 Sec. 102(e) Date Mar. 31, 1998 PCT Filed Oct. 6, 1996 PCT Pub. No. WO97/13614 PCT Pub. Date Apr. 17, 1997A device for measuring and/or checking the diameter of a cylindrical part (2) moving orbitally about an axis (3) during a grinding process. The device comprises a measuring head (7) coupled to a holder (18, 22) which is provided with a member (26) for engaging the circumference of the part (2), and is movably mounted in a direction parallel to itself on a frame (31) so that it can follow the orbital motion of the part (2). Grinding is performed by means of a tool (1) moving transversely to said axis (3), and the frame (31) is moved transversely to said axis and synchronised with the motion of the tool (1).
申请公布号 US6088924(A) 申请公布日期 2000.07.18
申请号 US19980043889 申请日期 1998.03.31
申请人 ETAMIC SA 发明人 ESTEVE, XAVIER
分类号 B23Q17/20;B24B5/42;B24B49/04;(IPC1-7):G01B5/20 主分类号 B23Q17/20
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