发明名称 METHOD FOR COATING MICROPARTICLE, COATED MICROPARTICLE, ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE AND ELECTROCONDUCTIVE CONNECTIVE STRUCTURAL BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for coating microparticles without the need of any large-scale apparatus, highly effective because of producing no uncoated microparticles, less prone to produce multiple particles, capable of easily controlling coating layer thickness, capable of coating a large quantity of microparticles, capable of coating ill-wettable microparticles and high-specific gravity microparticles as well, and enabling coating layer thickness to be even among particles. SOLUTION: This method for coating microparticles comprises preparing a mixture of microparticles, a coating substance and a dispersion medium, and forming a coating layer of each of the microparticles through removing the dispersion medium while gradually volatilizing it; wherein it is characteristic that the microparticles are each 0.2-3,000μm in average size, <5 in aspect ratio and <=40% in CV value, and the coating layer thickness is <=1/4 time the above average size.
申请公布号 JP2000198880(A) 申请公布日期 2000.07.18
申请号 JP19990293832 申请日期 1999.10.15
申请人 SEKISUI CHEM CO LTD 发明人 SUZUKI TAKUO;UKAI KAZUO
分类号 B05D7/00;B01J2/00;C08J7/04;C08K9/08;C09J9/02;C09J201/00;(IPC1-7):C08K9/08 主分类号 B05D7/00
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