| 摘要 |
PURPOSE: To obtain a surface-mount light-emitting diode which prevents a terminal part from being cracked and which prevents a molded part from being stripped by a method wherein a part which is the top of a substrate and which contains a bonding line where two sides parallel to the terminal part of at least the molded part come into contact with the substrate is covered with a solder resist film. CONSTITUTION: A substrate 2 uses a bonding line 6a as a boundary. On one side, the top 2a of the substrate 2 is exposed so as to include a terminal part 3a, a mounting part 3b or a wiring part 3c. On the other hand, the the top 2a of the substrate 2 covers a molded part 6 so as to include a terminal part 3a, a mounting part 3b or a wiring part 3c. A solder resist film 7 is formed on the top 2a of the substrate 2 so as to cover the exposed side and a side to be covered. The solder resist film 7 is flexible as compared with a member in which the substrate 2 and a conductive pattern 3 are formed. When it is sandwiched by a mold so as to be compressed, only the part of the resist film 7 is deformed, the substrate 2 is not deformed, and it is possible to prevent the terminal part from being cracked and to prevent the molded part from being stripped. |
