| 发明名称 |
WIRE FOR SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE: A wire for semiconductor device is provided to form grooves in spiral direction or lengthwise on outer surface of the wire in order to reduce only the volume of the balls formed in wire bonding, thereby realizing compacted package and preventing failure due to drooping of the wire loop. CONSTITUTION: A wire for semiconductor device comprises plural grooves(31) formed on outer surface of circular wire(3). The grooves(31) are formed in lengthwise and preferably consist of 4 grooves apart from right angle each other. The grooves(31) may be formed on the outer surface of the wire in spiral shape. Therefore, the volume of the balls formed in wire bonding can be reduced and reliability can be enhanced.</p> |
| 申请公布号 |
KR20000044013(A) |
申请公布日期 |
2000.07.15 |
| 申请号 |
KR19980060456 |
申请日期 |
1998.12.29 |
| 申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
GWAK, JAE SEONG;WOO, CHAN HEE |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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