发明名称 CONDITIONER OF CHEMICAL MECHANICAL POLISHING DEVICE
摘要 PURPOSE: A conditioner of a chemical mechanical polishing device is provided to solve a problem of equipment management due to a slurry adhered to a conditioner when performing a polishing process. CONSTITUTION: A conditioner of a chemical mechanical polishing device comprises a conditioner arm(12), a disc adhesion portion(16), an axis, and a wrinkles barrel(20). The conditioner arm moves a conditioner to a left direction or a right direction around a driving axis. The disc adhesion portion comprises a disc for forming a coarse surface of a pas. The axis connects the conditioner arm with the disc adhesion portion. The wrinkles barrel comprises wrinkles between the conditioner arm and the disc adhesion portion in order to surround the axis.
申请公布号 KR20000043823(A) 申请公布日期 2000.07.15
申请号 KR19980060246 申请日期 1998.12.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, CHAN YOUNG;YOON, MYUNG SEOB
分类号 H01L21/321;(IPC1-7):H01L21/321 主分类号 H01L21/321
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