发明名称 |
METHOD FOR ALIGNING WAFER |
摘要 |
PURPOSE: A method for aligning a wafer is provided to improve an alignment accuracy by performing an exposure and an alignment of a wafer at the same time. CONSTITUTION: In a method for aligning a wafer, pluralities of wafers(3,5) are mounted on a wafer stage(1) of an exposure equipment having an exposure lens(7) and an alignment module(9). The exposure lens(7) and the alignment module(9) are set so as to be directed into the same portion of each wafer thus mounted. During scanning the wafer stage(1) in order to expose a die of a wafer, the alignment module aligns the same die of another wafer so as to perform an exposure and an alignment of a wafer at the same time.
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申请公布号 |
KR20000045423(A) |
申请公布日期 |
2000.07.15 |
申请号 |
KR19980061981 |
申请日期 |
1998.12.30 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
LEE, SEUNG HYUK;KWON, GI SEONG |
分类号 |
H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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地址 |
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