发明名称 APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE
摘要 PURPOSE: A cavity tool used for a wire bonder is provided to be commonly employed for different sized chips. CONSTITUTION: In a wire bonding process, a lead frame(100) on which a semiconductor chip(200) is attached is placed on a heater block(300), and a cavity tool(10) presses down a top surface of the lead frame(100). The cavity tool(10) includes a window(11) centrally formed therein for exposing the chip(200) to be wire-bonded, and movable clamping blocks(14) enclosing the window(11). Each movable clamping block(14) is composed of a press unit(14a) that presses down the lead frame(100), and an insert unit(14b) that is smoothly inserted in a slide groove(13). The movable clamping blocks(14) are fixed to the cavity tool(10) by fastening screws(15). Since the movable clamping blocks(14) have variable positions along the slide groove(13) according to the size of the chip(200), the cavity tool(10) can be used regardless of the size of the chip(200).
申请公布号 KR20000042614(A) 申请公布日期 2000.07.15
申请号 KR19980058837 申请日期 1998.12.26
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 KIM, SEONG JIN;SEO, MUN SEOK
分类号 H01L23/28;(IPC1-7):H01L23/28 主分类号 H01L23/28
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