发明名称 METHOD FOR DIVIDING TRENCH DEVICE IN SEMICONDUCTOR
摘要 PURPOSE: A method for dividing trench device in semiconductor is provided to prevent the separation of boron by forming a barrier layer and the moat phenomenon inducing electric field focusing phenomenon by rounding the corner of a trench, thereby preventing the lowering of threshold voltage. CONSTITUTION: A method for dividing trench device in semiconductor comprises steps of: selectively etching a portions of a silicon substrate to form the trench on the device division area; forming an insulation film on internal wall of the trench; forming a barrier layer on the substrate contained the trench internal wall; embedding the insulation film into the trench; and oxidizing both top edges of the barrier layer by Vt screen oxidization process.
申请公布号 KR20000042402(A) 申请公布日期 2000.07.15
申请号 KR19980058567 申请日期 1998.12.24
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 JANG, SEONG GEUN;PARK, SANG WON
分类号 H01L21/76;(IPC1-7):H01L21/76 主分类号 H01L21/76
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