发明名称 |
METHOD FOR DIVIDING TRENCH DEVICE IN SEMICONDUCTOR |
摘要 |
PURPOSE: A method for dividing trench device in semiconductor is provided to prevent the separation of boron by forming a barrier layer and the moat phenomenon inducing electric field focusing phenomenon by rounding the corner of a trench, thereby preventing the lowering of threshold voltage. CONSTITUTION: A method for dividing trench device in semiconductor comprises steps of: selectively etching a portions of a silicon substrate to form the trench on the device division area; forming an insulation film on internal wall of the trench; forming a barrier layer on the substrate contained the trench internal wall; embedding the insulation film into the trench; and oxidizing both top edges of the barrier layer by Vt screen oxidization process.
|
申请公布号 |
KR20000042402(A) |
申请公布日期 |
2000.07.15 |
申请号 |
KR19980058567 |
申请日期 |
1998.12.24 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
JANG, SEONG GEUN;PARK, SANG WON |
分类号 |
H01L21/76;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|