发明名称 |
POLYMER STUD GRID ARRAY PACKAGE |
摘要 |
The polymer stud grid array has a 3-dimensional substrate (S) of an electrically insulating polymer, with a flat surface provided with polymer studs (PS), each having an external terminal (AA). Electrical conductor paths couple the external terminals to internal terminals (IA1), connected to the terminals of a semiconductor chip (C1) mounted on the substrate. Pref. the moulding and metallisation of the polymer studs is effected using moulded interconnection device technology, without requiring additional steps. |
申请公布号 |
AT194249(T) |
申请公布日期 |
2000.07.15 |
申请号 |
AT19950934106T |
申请日期 |
1995.09.22 |
申请人 |
SIEMENS N.V.;INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW |
发明人 |
HEERMAN, MARCEL;WILLE, JOOST;VAN PUYMBROECK, JOZEF;ROGGEN, JEAN;BEYNE, ERIC;VAN HOOF, RITA |
分类号 |
H01L23/12;H01L21/60;H01L23/13;H01L23/498;H05K3/02;H05K3/34;H05K3/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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