CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A chemical mechanical polishing apparatus is provided to be capable of detecting a polishing end point more exactly. CONSTITUTION: A chemical mechanical polishing apparatus comprises a polishing table support part(21) which supports a polishing table(22). A wafer support table(23) rotates a wafer(10) according to a driving by a motor(80), and has one plane connected to a rear surface of the wafer(10). A first vacuum pump(31) absorbs a polished substance existing on a pad of the polishing table(22). A gathering part(40) gathers a substance absorbed through the first vacuum pump(31), and an analyzer(50) analyzes the polished substance supplied from the gathering part(40). A second vacuum pump(32) absorbs the polished substance remaining at the analyzer after analyzing. A feedback system(70) receives an analyzed result to control an operation of the motor.