| 摘要 |
PURPOSE: A vacuum pad of a pickup head assembly is provided to hold an uneven semiconductor package, to cut down production costs, and to make compatible with other assemblies. CONSTITUTION: A vacuum pad of a pickup head assembly comprises a cylindrical covering member(32a) connected to a lower end of the pickup head assembly(10) and a cylindrical contact tube(34a) formed on the end of the covering member(32a), wherein the contact tube(34a) is made of a soft material. The vacuum pad(30a) is connected to the end of the pickup head assembly(10), wherein the vacuum pad(30a) is made of flexible plastics.
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