| 摘要 |
The method involves bonding the light emitting diodes to the circuit board using a first adhesive, the contacts of the light emitting diodes being connected to corresponding contacts on the circuit board. Prior to component mounting, the circuit board is bent. The connection between the contacts of the light emitting diodes and the contacts of the circuit board is made using a further adhesive. The circuit board may be heated to a temperature between 80 and 110 deg. C to harden the adhesive. Independent claims are included for a circuit board on which light emitting diodes are mounted, and for a traffic light. |
