HORIZONTAL CARRYING TEST HANDLER

摘要

A method of transferring IC devices with use of a horizontal transfer test handler in horizontal directions to and from a test head wherein the test handler includes a device tray for carrying a plurality of IC devices to be tested, an IC socket mounted on the test head to interface between the IC device under test and an IC tester by establishing electrical connections therebetween, and a reference position marker provided on an upper surface of the test handler. The method includes the steps of supplying input data regarding types of IC devices to be tested and data regarding device trays to carry the IC devices to be tested to the test handler, moving a device transfer mechanism for picking, transferring, and placing the IC devices in horizontal and vertical directions on the horizontal surface of the test handler wherein the device transfer mechanism has a video data acquisition means, acquiring video data indicating an image shown at each location on the upper surface of the test handler through the video data acquisition means by changing positions over the horizontal surface in accordance with the movement of the device transfer mechanism, processing video data on the horizontal surface of the test handler including said IC socket and performing a positional calibration process by comparing data representing a center of the IC socket and said reference position marker to produce a correction factor, processing the video data to determine a size of the device tray represented and judging whether the size of the IC tray matches tray size data in the input data, processing the video data to determine whether the IC socket on the horizontal surface of the test handler matches the IC device type data, correcting a center position of the IC device under test by changing a position of the device transfer mechanism based on the correction factor, and moving the device transfer mechanism between the device tray and the IC socket for picking, transferring, and placing the IC devices in horizontal and vertical directions on the horizontal surface of the test handler for testing the IC devices.