| 摘要 |
PURPOSE: A protection tape adhesion equipment of a wafer is provided to cut a wafer adhered with a protection tape according to a wafer shape after adhering the protection tape on the wafer. CONSTITUTION: A protection tape adhesion equipment of a wafer comprises a wafer supply portion for supplying a wafer, a tape adhesion portion for adhering a protection tape to a part of a wafer, a tape cutting portion for cutting the protection tape according to a wafer shape, and a wafer loading portion for loading the wafer adhered by the protection tape. The tape cutting portion comprises a cutting body(121) for performing horizontal rotation movement, an operation cutting portion(133) combined to a side face of the cutting body, an elastic member(134) combined between the cutting body and the operation cutting portion, and fixing portion for fixing the wafer.
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