| 发明名称 |
ELECTRONIC PACKAGE WITH STRAIN RELIEF MEANS AND METHOD OF MAKING |
| 摘要 |
<p>An electronic package includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements. <IMAGE></p> |
| 申请公布号 |
KR100261959(B1) |
申请公布日期 |
2000.07.15 |
| 申请号 |
KR19960066138 |
申请日期 |
1996.12.16 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALCOE DAVID JAMES;ANDERSON STEVEN WAYNE;GUO YIFAN;JOHNSON ERIC ARTHUR |
| 分类号 |
H01L21/60;H01L23/12;H01L23/13;H01L23/16;H01L23/373;H01L23/495;H01L23/498;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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