发明名称 |
METHOD FOR MANUFACTURING DECOUPLING CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for fabricating a decoupling capacitor of a semiconductor device is provided to improve the reliance and features of the semiconductor device by forming the decoupling capacitor to have an increased capacitance. CONSTITUTION: An isolation area and a decoupling capacitor forming area(200) are formed on a semiconductor substrate(31) by patterning a pad oxidized film(33) and a pad nitride film(35). A nitride film spacer is formed on a side wall of the structure consisting of the pad oxidized film(33) and the pad nitride film(35). An isolation film(39) is formed on the isolation area. By etching the nitride film spacer and the pad nitride film(35), the semiconductor substrate(31) corresponding to the decoupling capacitor forming area is exposed. Then, a plurality of trenches(41) are formed on the semiconductor substrate(31) corresponding to the decoupling capacitor area. After forming a gate oxidized film(43) and a conductive layer(45), the gate oxidized film(43) and the conductive layer(45) are patterned so that a gate electrode and a decoupling capacitor are provided.
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申请公布号 |
KR20000045474(A) |
申请公布日期 |
2000.07.15 |
申请号 |
KR19980062032 |
申请日期 |
1998.12.30 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
KIM, JI HYUNG;KIM, YONG TAEK |
分类号 |
H01L27/04;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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