| 摘要 |
PURPOSE: A chip sized package having a capacitor and a fabrication method thereof are provided to improve a mounting density of the package to a mother board. CONSTITUTION: A first insulating layer(21) is coated on a semiconductor chip(10) but pads(11) centrally formed on the chip(10) are exposed. First metal patterns(31) are deposited on the insulating layer(21) so that first end of each metal pattern(31) is connected with each pad(11). A second insulating layer(22) is coated on the first insulating layer(21) while covering almost the first metal patterns(31) but exposing second end of each metal pattern(31). A capacitor having electrodes(42) on a die(41) is formed on the second insulating layer(22) above the pads(11). A third insulating layer(23) covers the capacitor except the electrode(42). Second metal patterns(32) are connected with the electrode(42) at first ends thereof and connected with the second ends of the first metal patterns(31) at second ends thereof. A fourth insulating layer(24) is formed on overall surfaces but exposing the second ends(i.e., ball lands) of the second metal patterns(32). After solder paste is applied to the ball lands, solder balls(51) are mounted on the solder paste. |
