COOL SOLDERING PREVENTING STRUCTURE OF ELECTRONIC COMPONENT ON SUBSTRATE

摘要

PURPOSE: A cool soldering preventing structure of an electronic component on a substrate is provided to discriminate the inferiority of soldering of a mounting chip. CONSTITUTION: A cool soldering preventing structure checks whether the soldering of a soldered part(32) formed for electrical contact between a lead part(31) of an electronic component(30) and a pattern(1') of a PCB substrate(1) is good or not by the conduction of an electrical signal. The lead part of the electronic component is attached to the PCB substrate by a bond point(30') and is mounted on the PCB substrate by the soldering. A separation point(40) higher than the pattern(1') is formed on the PCB substrate so that the lead part does not contact electrically with the pattern when being attached to a position except the lead part and the bond part of the electronic component.