STRUCTURE OF INNER LEAD BONDING DEVICE FOR TAPE CARRIER PACKAGE MANUFACTURING PROCESS

摘要

PURPOSE: A structure of an inner lead bonding device used for fabricating a tape carrier package is provided to rapidly pre-align a semiconductor chip by improving the structure of a pre-aligning device. CONSTITUTION: Leads(3) are arranged on a tape(2) and a pick-up device(30) is provided for conveying semiconductor chips(10) separated from a wafer(1). Semiconductor chips(10) conveyed by the pick-up device(30) are rested on semiconductor chip pre-aligning devices(210, 220). A conveying plate(300) allows each semiconductor chip pre-aligning devices(210, 220) to be symmetrically supported to each other. A conveying device is provided for alternatively transferring each side of the conveying plate(300) to a bonding process position and a pick-up position.