METHOD FOR PREPARING PLATED LAYER OF INSULATING RESIN SUBSTRATE

摘要

PURPOSE: A method for preparing a plated layer of insulating resin substrate is provided which makes it simple and easy to plate copper on the surface of the insulating resin of build-up substrate using thermosetting insulating resin or photosensitive insulating resin. CONSTITUTION: A method for preparing a plated layer of insulating resin substrate comprises forming a concavity at the limb of the copper-clad substrate to form an internal circuit part; coating the internal circuit part of the substrate with an insulating resin layer up to a certain thickness, leaving a part of the copper-clad layer not coated at the limb of the internal circuit part; and forming a plated layer at the top of the insulating resin layer on the basis of the copper-clad layer at the limb of the internal circuit part.