| 摘要 |
PURPOSE: A heat sink for a printed circuit board is provided to be capable of improving the fixing structure of the heat sink for simultaneously performing the fixing work of the heat sink during an automatic soldering process of elements mounted on the printed circuit board, thereby greatly enhancing the productivity. CONSTITUTION: The heat sink comprises a vertical plate(12), a supporting plate(14) bended on both sides of the vertical plate(12), fixed protrusions(16) and mounting pins(20). The fixed protrusions(16) are formed in internal lower parts of the supporting plate(14) in an embossing shape. The mounting pins(20) are inserted and fixed to the fixed protrusions(16) and are inserted into an inserting hole(100a) of the printed circuit board(100) to be soldered.
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