METHOD FOR REMOVING MOLD FLASH OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: In a molding process of a semiconductor package, a method for easily removing a mold flash produced on ball lands without damaging the package is provided. CONSTITUTION: In a molding process, a molding material(30) is infiltrated into interface between ball lands(10) and a lower mold die, and thereby an undesirable mold flash(31) is produced on the ball lands(10). To easily and effectively remove the mold flash(31), a covering layer(20) is in advance formed on each ball land(10). Preferably, a material such as epoxy easily dissolvable in chemical solution is employed as the covering layer(20). When the molding process is performed with presence of the covering layer(20), the mold flash(31) is formed on the covering layer(20) not the ball land(10). Therefore, as the covering layer(20) is dissolved in chemical solution, the mold flash(31) comes off the ball land(10). The mold flash(31) is easily removed by subsequent polishing or water-injection process.