SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the semiconductor package are provided to reduce the manufacturing cost of the semiconductor package by simplifying the manufacturing process. CONSTITUTION: A semiconductor package has a lead frame(10) consisting of a bonding portion(12), a solder ball land portion(14) and a circuit pattern portion(16). A semiconductor chip(30) is attached to an upper surface of the lead frame(10) by using an adhesive(20). The lead frame(20), the bonding portion(12) and the semiconductor chip(30) are electrically connected by a wire(40). A seal member(40) is provided to seal the semiconductor chip(30), the wire(40) and the lead frame(20). A cover coat(60) is attached to a lower surface of the lead frame(20) and a terminal(70) is connected to the solder land portion(14) of the lead frame(20).